The aluminum substrate is suitable for circuits with special requirements. Such as thick-film hybrid integrated circuits, heat dissipation of power circuits, heat dissipation and cooling of components in the circuit, large-scale substrates that ceramic substrates are difficult to handle, and circuits that cannot solve reliability with ordinary heat sinks.
| LAYER | PROTOTYPE | MASS PRODUCTION (above 20 m2) | |
| Quick Turn | Standard Time | ||
| MC PCB | 48 hours | 4-5 days | 10-12 days |
| PFC 1 L | 48 hours | 5-6 days | 12-13 days |
| 1L | 24 hours | 3-4 days | 8-10 days |
| 2L | 24 hours | 3-4 days | 8-10 days |
| 4L | 48 hours | 5-6 days | 8-10 days |
| 6L | 72 hours | 6-7 days | 10-12 days |
| 8L | 72 hours | 7-8 days | 12-14 days |
| 10L | 96 hours | 9-10days | 16-18 days |
| PCB Prototype | Quick Turn PCB | Single-Sided PCB |
| Double-Sided PCB | Multilayer PCB | Rigid PCB |
| Flexible PCB | Rigid-Flex PCB | LED PCB |
| Aluminum PCB | Metal Core PCB | Thick Copper PCB |
| HDI PCB | BGA PCB | High TG PCB |
| PCB Stencil | Impedance Control PCB | PCB Assembly |
| High-Frequency PCB | Bluetooth Circuit Board | Automotive PCB |
| USB Circuit Board | Halogen-Free PCB | Antenna PCB |
