The heat dissipation of the aluminum substrate is related to its insulating layer thickness and thermal conductivity. The thinner the insulating layer, the higher the thermal conductivity of the aluminum substrate (but the lower the voltage resistance). In order to ensure the performance of electronic circuits, some components in electronic products need to prevent electromagnetic radiation and interference. The aluminum substrate can act as a shielding plate to shield electromagnetic waves.
| LAYER | PROTOTYPE | MASS PRODUCTION (above 20 m2) | |
| Quick Turn | Standard Time | ||
| MC PCB | 48 hours | 4-5 days | 10-12 days |
| PFC 1 L | 48 hours | 5-6 days | 12-13 days |
| 1L | 24 hours | 3-4 days | 8-10 days |
| 2L | 24 hours | 3-4 days | 8-10 days |
| 4L | 48 hours | 5-6 days | 8-10 days |
| 6L | 72 hours | 6-7 days | 10-12 days |
| 8L | 72 hours | 7-8 days | 12-14 days |
| 10L | 96 hours | 9-10days | 16-18 days |
| PCB Prototype | Quick Turn PCB | Single-Sided PCB |
| Double-Sided PCB | Multilayer PCB | Rigid PCB |
| Flexible PCB | Rigid-Flex PCB | LED PCB |
| Aluminum PCB | Metal Core PCB | Thick Copper PCB |
| HDI PCB | BGA PCB | High TG PCB |
| PCB Stencil | Impedance Control PCB | PCB Assembly |
| High-Frequency PCB | Bluetooth Circuit Board | Automotive PCB |
| USB Circuit Board | Halogen-Free PCB | Antenna PCB |
