Black HDI High Density PCB Electronic Printed Circuit Board
Electronic Printed Circuit Board Osp Pcb High Density Black PCB Printed Circuit Board
The HDI board is made by coating or laminating a dielectric layer (or resin-coated copper foil) on the surface of the "core board" and forming micro vias. Drilling requires high-precision equipment manufacturing, laser For drilling machines, these micro-vias need to be metallized and copper electroplated to realize these micro-vias to achieve electrical interconnection between layers. If the aspect ratio is not large, use horizontal hole plating, and use the vertical hole plating for blind holes with a larger aspect ratio (especially those with a large aspect ratio, such as the aspect ratio greater than 0.8).
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LAYER |
PROTOTYPE |
MASS PRODUCTION (above 20 m2) |
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Quick Turn |
Standard Time |
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|
MC PCB |
48 hours |
4-5 days |
10-12 days |
|
PFC 1 L |
48 hours |
5-6 days |
12-13 days |
|
1L |
24 hours |
3-4 days |
8-10 days |
|
2L |
24 hours |
3-4 days |
8-10 days |
|
4L |
48 hours |
5-6 days |
8-10 days |
|
6L |
72 hours |
6-7 days |
10-12 days |
|
8L |
72 hours |
7-8 days |
12-14 days |
|
10L |
96 hours |
9-10days |
16-18 days |
FAQ:
Q1. How can I get a sample to check your quality?
A: After price confirmation,you can place orders for samples for your testing and evaluation.
Q2. Is it OK to print my logo on product?
A: Yes. Please inform us formally before our production and confirm the design firstly based on our sample.
