Structure of aluminum PCB: 
PCB aluminum based copper clad laminate is a kind of metal circuit board material, which is composed of copper foil, thermal insulation layer and metal substrate

1)  Circuit layer: equivalent to common PCB copper clad laminate, circuit copper foil thickness from 1oz to 10oz.

2)  Insulating layer: insulating layer is a layer of low thermal resistance thermal insulation material. Thickness: 0.003 "to 0.006" inch is the core technology of aluminum based copper clad laminate, which has obtained UL certification.

3)  Base: is a metal substrate, generally aluminum or optional copper. Aluminum based copper clad laminates and traditional epoxy glass cloth laminates

PCB aluminum substrate is composed of circuit layer, thermal insulation layer and metal base layer; circuit layer (i.e. copper foil) is usually etched to form printed circuit, so that the components of components are connected with each other. Generally, the circuit layer requires a large current carrying capacity, so thick copper foil should be used, with a thickness of 35 μ m ~ 280 μ M. Thermal insulation layer is the core technology of PCB aluminum substrate. It is generally composed of special polymer filled with special ceramics. It has small thermal resistance, excellent viscoelastic performance, thermal aging resistance, and can withstand mechanical and thermal stress. This technology is used in the thermal insulation layer of High Performance PCB aluminum substrate, such as IMS-H01, IMS-H02 and LED-0601, which makes them have excellent thermal conductivity and high strength electrical insulation performance.