OEM ODM Double Sided 1.6mm FR4 PCB For Power Bank Electronics
FR4 OEM double-sided power bank pcb circuits boards pcb for electronics
1. Base Material :FR4
2. Layer :1~8
3. Board Thickness :0.4~3.2mm
4. Board Thickness Tolerance: ±10%
5. Finised Outer Copper Thickness:1~2oz(35~70μm)
6. Finised Inner Copper Thickness: 0.5~1oz(17~35μm)
7. Min Board Size:5*5mm
8. Max Board Size:550*560mm
9. Min Line Width/Space: 3/3mil
10. Min Hole Size :0.2mm
11. Hole Tolerance: ±0.07mm/±0.05mm
12. Solder Mask: Green,Red, Blue,White,Black,Yellow,etc.
13. Surface Finish: HASL, HASL lead free,OSP, Immersion gold/Tin/ Silver, Hard gold, Flash gold,etc.
14. Flammability: 94V-0
15. Min S/M Bridge: 4mil
16. Character Width: ≥0.1mm
17. Character Height: ≥0.08mm
18. Certificate: ISO ROHS UL
19. Value-added : Service Design,Clone,Assembly,Manufacture
20. Application: Consumer electronic,Industrial control,Green energy, Air conditioner,Washing machine,electronic equipment,etc.
FR4 PCB can be any layer count but rely on conventional drilling and plating technology.
FR4 PCB up to 40+ layers
Wide range of laminate options including high temperature, low loss, and lead-free laminates
Mixed dielectric (hybrid) constructions
Panel size up to 30″x 55″
Embedded coin or metal core and metal-backed MLB
Panel thickness up to.450″
RF and microwave circuits
Heavy copper (10 oz. outer layer / 5 oz.
Embedded, distributed and discrete passive components
|Contact Person :||Yolanda Yao|