Fr4 Base PCB Gold Plated 2oz Copper Printed Circuit Board
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Basic Infomation
Place of Origin: China
Brand Name: Yizhuo
Certification: CE,ROHS,UL
Model Number: Aluminum Pcb Board 01
Payment & Shipping Terms
Packaging Details: Vacuum Package+ Good quality carton box
Delivery Time: 10-12 work days
Payment Terms: T/T, Western Union
Brand Name: Yizhuo
Base Material: Aluminum Base
Copper Thickness: 1/2OZ
Peelable: 0.3-0.5mm
Profiling Punching: Routing, V-CUT, Beveling
Service: One-stop Service
Product Description

Aluminum Base PCB Gold Plated 2oz Copper Printed Circuit Board
Fr4 Base PCB Gold Plated 2oz Copper Printed Circuit Board 0

  1. EMS-Electronic Manufacturing Service
  2. PCB design and PCB Layout
  3. PCB Assembly on SMT, BGA, and DI
  4. Cost-Effective Components Sourcing
  5. Fast Turn Prototype and Mass Production
  6. Box Build Assembly
  7. Engineering Support
  8. Tests(X-ray, 3D Paste Thickness, ICT, AOI, and Functional tests)
  9. Logistics and After-sales Service

Fr4 Base PCB Gold Plated 2oz Copper Printed Circuit Board 1

PCB layers 1-layer to 10-layer(including HDI board)
Finish type Gold-plated,Immersion gold-plated, HAL finish , Flux., Carbon -bridge, Entek, Nickel plating
Base material FR4,CEM-1,CEM-3,FR1,FR2, Aluminium metal substrate and Rogers
Base material thickness 0.4-2.4mm.
Copper foil thickness 18um(H/HOZ) ,35um(1/1OZ) ,70um(2/2OZ), 5OZ
Maximum-product board 500*700mm. For AL PCB: 500*1400mm
Minimum drilled hole size 0.075mm
Minimum track width/spacing 3mil
Average hole wall copper Thickness for HAL board: ≥25um.Gold-finger plating: ≥0.1um
Solder mask ink Photo cure ink, heat cure ink. UV ink
Outline tolerance ±0.1mm
Hole diameter tolerance/ Hole location tolerance ±0.076mm/±0.076mm
V-CUT tolerance ±0.1mm.
Warp According to the IPC-600F standard
lead time Single-sided: 2-3 working days; Double-sided: 3-4 working days; Multi-layer: 8-10 working days


PCB assembly Layers 1 Layer to 36 layers (standard),
PCB assembly material/type FR4, Aluminum, CEM1, Super-thin PCB, FPC/Gold finger
PCB Assembly service type DIP/SMT or Mixed SMT & DIP
Copper thickness 0.5um-4um
Assembly surface finish HASL,ENIG,OSP
PCB Dimension 600x1200mm
IC Pitch(min) 0.2mm
Chip Size(min) 01005
Leg distance(min) 0.3mm
PCB BGA Size 8x6mm~55x55mm
u-BGA ball dia. 0.2mm
Required Docs for PCBA Gerber file with BOM list & Pick-N-Place File(XYRS)
SMT speed CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs


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Contact Person : Yolanda
Tel : +86-13530179598
Fax : 86-755-33115535
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