FR4 multilayer pcb board assembly Manufacturer Rohs Circuit Board
FR4 multilayer pcb board introduction:
FR-4 (or FR4) is a grade designation assigned to glass-reinforced epoxy laminate sheets, tubes, rods and printed circuit boards (PCB). FR-4 is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant (self-extinguishing).
"FR" stands for flame retardant, and denotes that safety of flammability of FR-4 is in compliance with the standard UL94V-0. FR-4 was created from the constituent materials (epoxy resin, woven glass fabric reinforcement, brominated flame retardant, etc.) by NEMA in 1968.
FR-4 glass epoxy is a popular and versatile high-pressure thermoset plastic laminate grade with good strength to weight ratios. With near zero water absorption, FR-4 is most commonly used as an electrical insulator possessing considerable mechanical strength. The material is known to retain its high mechanical values and electrical insulating qualities in both dry and humid conditions. These attributes, along with good fabrication characteristics, lend utility to this grade for a wide variety of electrical and mechanical applications.
NEMA is the regulating authority for FR-4 and other insulating laminate grades. Grade designations for glass epoxy laminates are: G10, G11, FR4, FR5 and FR6. Of these, FR4 is the grade most widely in use today. G-10, the predecessor to FR-4, lacks FR-4's self-extinguishing flammability characteristics. Hence, FR-4 has since[when?] replaced G-10 in most applications.
FR-4 epoxy resin systems typically employ bromine, a halogen, to facilitate flame-resistant properties in FR-4 glass epoxy laminates. Some applications where thermal destruction of the material is a desirable trait will still use G-10 non flame resistant.
FR-4 Process capability
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Item
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Craft Ability
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Surface Finish
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HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
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Layer
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1-32 layers
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Min.Line Width
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4mil
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Min.Line Space
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4mil
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Min.Space between Pad to Pad
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3mil
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Min.Hole Diameter
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0.20mm
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Min.Bonding Pad Diameter
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0.20mm
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Max.Proportion of Drilling Hole and Board Thickness
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1:10
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Max.Size of Finish Board
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23inch*35inch
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Rang of Finish Board′s Thickness
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0.21-3.2mm
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Min.Thickness of Soldermask
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10um
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Soldermask
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Green,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask
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Min.Linewidth of Idents
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4mil
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Min.Height of Idents
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25mil
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Color of Silk-screen
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White,Yellow,Black
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Date File Format
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Gerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++
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E-testing
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100%E-Test:High Voltage Testing
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Material for PCB
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High TG Material:High Frequence ROGERS,TEFLON,TADONIC,ARLON(Haloger free Material)
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E-testing
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Impedance Testing,Resisitance Testing,Microsection etc
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Special Technological Requirement
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Blind&Buried Vias and High Thickness Copper
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1. Single side FR4 PCB
The Fr4 single-side printed circuit boards are made of epoxy resin PCB having copper foil on one side, its components are pasted on one side.
2. Double side FR4 PCB
The Fr4 single-side printed circuit boards also are made of epoxy resin PCB having copper foil on one side, but its components are pasted on two sides which give the path of traces to cross each other.
These boards contain copper for conduction.
3. Multiple layers FR4 PCB
The multisided PC board has more than two layers. It contains three layers of material for conduction.
That is pasted in the center of the materials. The core material is laminated together under high pressure and high temperature to produce multilayer PC boards. Components are pasted on both sides of PC boards.
4. Rigid FR4 PCB
In this type of Fr4 PC board, the core materials used are only Fr, so that is why this is called a rigid fr4 printed circuit board.
There are no other materials or impurity added to it it’s a pure circuit, that is why it is rigid for the whole PC board.
5. Rigid-flex FR4 PCB
In this type of PC board, the core material is rigid as well as flexible so they are called rigid-flex Fr4 PC boards.
The flex is due to circuit flexibility. We used thin boards because it is more flexible and more vulnerable to heat.
During soldering, it can be bending to make a desirable angle.
FR4 multilayer pcb board Application
Shenzhen Yizhuo Electronics Co., Ltd. is a national high-tech enterprise certified to ISO9001: 2015 international quality management system. We have CE, ROHS, UL certification. It was founded in 2012 and factory area consists of more than 6,000 square meters, 131 employees, and two shifts. We have the capability to manufacture aluminum PCBs, FR4 PCBs, LED PCBA, and other related products. We are also providing services like PCB design, PCB assembly, and LED SMT board processing for PCB designing services. The products are widely used in lighting, electronics, communications, automotive and other industries that require heat dissipation. Our professionals work in close association to understand the specific requirements of our clients. In our quality testing unit, we meticulously test each product, thus results in their compliance with international quality standards. We can do ODM or OEM one-stop service for our customers.
We are supported by a ‘state-of-the-art’ infrastructural base and team of enthusiastic and skilled professionals. we have divided our well-developed infrastructural base into various units such as procuring, designing, manufacturing, quality testing, R & D, sales marketing, warehousing packaging, and more. This facilitates us to deliver totally defect free range product to our clients at the leading market prices and equipped with the latest machinery and innovative technology in order to meet the large-scale orders of customers. With a senior management team and R & D design team with an average industry experience of more than 10 years, our products are selling well around the world.
The process of making a multilayer PCB:
Several factors go into producing high-quality multilayer PCBs. The process involves specific steps necessary to ensure every aspect is covered. Since there are different types of multilayer boards, the manufacturing process may be different based on the unique design you want to achieve. Besides front end planning, the general procedure involves:
· Photo plotting – converts the photo data and converts it to the image pixel .
· Imaging and DES (develop, etch, strip) – applies the primary image on to the PCB .
· Automated optical inspection – inspects the layers of the multiplayer PCB before lamination .
· Oxide treatment and lamination – chemical treatment applied to the inner layers of the PCB. Lamination binds the different layers of copper and fiberglass together .
· Drilling and electroless copper deposition – this process creates the required drill holes and trenches on the PCB. They are then covered by copper deposits .
Electrical test, fabrication, micro-sectioning, and final inspection
FAQ:
Q1. What file formats do you accept for PCB PCBA production?
A: Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel
Q2. How can I get a sample to check your quality?
A: After price confirmation,you can place orders for samples for your testing and evaluation.
Q3. How about your supply capacity?
A: Our supply capacity is around 2000sqm each day. where our 25 000 sqm factory space hosts R&D, marketing, logistics and procurement operations.