August 20, 2021
This layer consists of an electrolytic copper foil that ranges from 1 to 10 ounces (oz). During its manufacture, the designer etches the copper material to form a printed circuit. Its function is to apprehend the assembly and connect devices for ease in functionality. It being an IMS, the substrate layer carries a higher current. Nonetheless, it still possesses a similar thickness and width to an FR-4 stiffener.
The dielectric layer is best known for its thermal conduction. In thickness, manufacturers estimate them to be approximately 50µm to 200µm thick. It has the function of insulating, bonding, and dissipating heat from the board during current flow.t
Inarguably, this layer defines an IMS by totally distinguishing it from other PCBs. In other words, the insulating layer consists of a metal core made of an aluminum substrate. Factors you should consider when searching for a reliable metal plate are cost-effectiveness, strong point, firmness, mass, thermal coefficient, and most importantly, thermal conductivity.
With that said, an aluminum plate meets all the criteria above. Even better, you can enhance its efficiency in conductivity or mechanical properties by adding other leaves—for instance, copper, iron, and silicon steel plates.
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