Aluminum PCB are the most common type – the base material consists of an aluminum core with standard FR4. It features a thermal clad layer that dissipates heat in a highly efficient manner while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCBs is regarded as the solution to high power and tight tolerance applications.

Aluminum PCB substrates can be divided into tin-sprayed aluminum substrates, anti-alumina substrates, silver-plated aluminum substrates, immersion gold aluminum substrates, etc. according to the process; they can be divided into: street light aluminum substrates, fluorescent aluminum substrates, LB aluminum substrates, and COB aluminum substrates. , Package aluminum substrate, bulb lamp aluminum substrate, power aluminum substrate, automotive aluminum substrate, etc.

Aluminum PCB and copper pcb also have the following unique advantages:

Ø Meet RoHs requirements;

Ø More suitable for SMT process;

Ø Extremely effective treatment of thermal diffusion in the circuit design scheme, thereby reducing the module operating temperature, extending and extending, and improving power density and reliability;

Ø Reduce the assembly of heat sinks and other hardware (including thermal interface materials), reduce product size, reduce hardware and assembly costs; Ø Optimize the combination of power circuits and control circuits

Ø Replace fragile ceramic substrates for better mechanical durability.