Aluminum substrate structure

(1) Metal base

Aluminum-based substrates, using LF, L4M, and Ly12 aluminum, require an expansion strength of 30 kgf/mm2 and an elongation of 5%. The US Begas aluminum base layer is divided into four types of 1.0, 1.6, 2.0, and 3.2 mm, and the aluminum type is 6061T6 or 5052H34.

(2) Insulation layer

Insulation, usually 50~200um. If it is too thick, it can act as an insulator to prevent short-circuiting with the metal base, but it will affect the heat dissipation; if it is too thin, it can dissipate heat well, but it is easy to cause the metal core and the component lead to be short-circuited.

Aluminum substrate thermal conductivity standard introduction

The thermal conductivity of aluminum substrate is one of the important indicators to evaluate the quality of aluminum substrate. The other two important factors are the thermal resistance of aluminum substrate and the withstand voltage of aluminum substrate. The thermal conductivity of aluminum substrate is generally on the market. Is 2.00.1, the specific thermal conductivity of the aluminum substrate can be measured by the instrument, the thermal conductivity of the aluminum substrate will directly affect the price of the aluminum substrate, in general, the higher the thermal conductivity of the aluminum substrate relative The price of the aluminum substrate will be higher. For the quality of the aluminum substrate, it is not unilateral to look at the thermal conductivity of the aluminum substrate. The performance of the aluminum substrate is determined by the thermal conductivity of the aluminum substrate, the thermal resistance of the aluminum substrate, and the withstand voltage. It is not determined by a single factor.

The thermal conductivity of the aluminum substrate is generally fixed and does not change with external factors. The thermal conductivity is determined mainly by the raw material of the aluminum substrate. If high thermal conductivity materials such as copper and silver are added, the thermal conductivity of the aluminum substrate material will definitely be higher. Thermal conductivity is a basic physical quantity, a fixed component of a material, and its thermal conductivity is independent of thickness or area.

At present, the high thermal conductivity is usually ceramics, copper, etc. However, due to the consideration of cost, most of the aluminum substrates are on the market today, and the corresponding thermal conductivity of the aluminum substrate is a parameter that everyone cares about. The higher the thermal conductivity is One of the symbols that represents the better function. The aluminum substrate is a common metal-based copper-clad aluminum substrate with good thermal conductivity, electrical insulation and mechanical processing functions. The thermal conductivity of aluminum substrates usually varies from 1.0, 1.5, and 2.0. The specific situation depends on the needs of the product.