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Base Material |
FR-4 /Aluminum /CEM-1 |
Layers |
1-22 |
Finised inner/outer copper thickness |
1-6OZ |
Finished board thickness |
0.2-7.0mm |
Min hole size |
Mechanical hole: 0.15mm Laser hole: 0.1mm |
Controlled Impedance |
+/-5% |
Plugging vias capability |
0.2-0.8mm |
Outline profile |
Rout/ V-cut/ Bridge/ Stamp hole |
Surface treatment |
HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OPS... |
The Aluminum PCB Manufacturing process:
1. Cutting laminate
The process of material opening-cutting
The purpose of cutting
Cut large-size incoming materials to the size required for production
Precautions for cutting
① Open the first piece to check its size
② Look for scratches on aluminum surface and copper surface
③ Pay attention to the delamination and the front of the board
2. Drilling
Drilling process
Pinning-drilling-board inspection
The purpose of drilling
Positioning and drilling of plates provides assistance for subsequent production processes and customer assembly
Precautions for drilling
① Check the number of holes and the size of holes
② Avoid scratches on the sheet
③ Check the front of the aluminum surface and the deviation of the hole position
④ Check and replace the drill bit in time
⑤ The drilling is divided into two stages: first, after cutting, drill the peripheral tool hole; second, drill tool hole in the unit after solder mask
3. Dry/wet film Developing
Dry/wet film developing process
Grinding board-filming-exposure-development
The purpose of dry/wet film developing
Show the parts needed to make the circuit on the sheet
Precautions for dry/wet film developing
① Check whether there is an open circuit after development
② Check whether there is deviation in the development registration to prevent the occurrence of dry film breakage
③ Pay attention to the defective circuit caused by scratches on the board surface
④ Ensure that no air remains during exposure to prevent poor results
⑤ After exposure, keep still for more than 15 minutes before developing
4. Acid/alkaline etching
Acid/alkaline etching process
Etching-film removal-drying-board inspection
Purpose of acid/alkaline etching
After imaging the dry/wet film, keep the required circuit parts and remove the excess parts other than the circuits. Pay attention to the corrosion of the etching solution on the aluminum substrate during acid etching.
Precautions for acid/alkaline etching
① Note whether the etching is not clean, or that the etching is excessive
② Pay attention to line width and line thinness
③ Ensure that there is no oxidation or scratching on the copper surface
④ Remove the dry film to clean
5. Silk screen solder mask, characters
Silk screen solder mask and character process
Silk screen-pre-bake-exposure-development-characters
The purpose of the silk screen solder mask and characters
FAQ:
Q1. How about your supply capacity?
A: Our supply capacity is around 2000sqm each day. where our 25 000 sqm factory space hosts R&D, marketing, logistics and procurement operations.
Q2. How can I get a sample to check your quality?
A: After price confirmation,you can place orders for samples for your testing and evaluation.
Q3: Does our product will be tested before shipment?
A: Yes, we could provide Function Circuit Testing .