Working principle of aluminum PCB:

The surface of the power device is mounted on the circuit layer. The heat generated by the operation of the device is quickly transmitted to the metal base through the insulation layer, and then the heat is transferred from the metal base to achieve the heat dissipation of the device.

Compared with the traditional FR-4 the aluminium PCB can reduce the thermal resistance to the minimum, which makes the aluminium substrate have excellent thermal conductivity. Compared with the thick-film ceramic circuit its mechanical properties are better.

In addition, aluminum PCB have the following unique advantages:

It meets the requirements of RoHs and it is more suitable for SMT process.

In the design of the circuit, thermal diffusion is treated effectively to reduce the operating temperature of the module, prolong the service life, and improve the power density and reliability.

Reduce the assembly of radiator and other hardware (including thermal interface materials), reduce product volume, reduce hardware and assembly costs, optimize the combination of power circuit and control circuit. Substitute the fragile ceramic substrates for better mechanical durability.